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LFE2-20E-6FN484C Compact 153-MBGA Package: Space-efficient 8x8mm

LFE2-20E-6FN484C Compact 153-MBGA Package: Space-efficient 8x8mmProduct attributes Property Value Manufacturer Lattice Semiconductor Corporation Product Series ECP2 Packaging Tray Tray Number of LABs CLBs 2625 Number of Logic Elements Cells 21000 Total RAM Bits 282624 Number of I O 331 Number of Gates Voltage Supply 1. 14V ~ 1. 26V Mounting Type Surface Mount Operating Temperature 0C ~ 85C (TJ) Grade Qualification Package Case 484 BBGA Supplier Device Package 484 FPBGA (23x23) ROHS

SKU: 85138195472 · From clintoncounty708.com

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USD69.64 USD101.64

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Ships within 48 hours · Estimated delivery Aug 23 - Aug 28

Description

Compact 153-MBGA Package: Space-efficient 8x8mm ball grid array for high-density PCB designs

AGL600V2-FG256 - High-Performance IGLOO FPGA from Microchip Technology

Surface Mount Technology - Easy integration into automated assembly processes

visit our HQICKEY Technical Blog where our engineering team shares application notes

LFE2-20E-6FN484C Compact 153-MBGA Package: Space-efficient 8x8mmProduct attributes Property Value Manufacturer Lattice Semiconductor Corporation Product Series ECP2 Packaging Tray Tray Number of LABs CLBs 2625 Number of Logic Elements Cells 21000 Total RAM Bits 282624 Number of I O 331 Number of Gates Voltage Supply 1. 14V ~ 1. 26V Mounting Type Surface Mount Operating Temperature 0C ~ 85C (TJ) Grade Qualification Package Case 484 BBGA Supplier Device Package 484 FPBGA (23x23) ROHS

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